Samsung Shares Plans for 2nm and 1.4nm Chips

Samsung unveiled its updated fabrication technology roadmap at its annual Samsung Foundry Forum (SFF) 2023. The company is on track to produce chips on its its 2nm and 1.4nm-class nodes in 2025 and 2027, respectively. In addition, the company intends to add a leading-edge 5nm-class radio frequency manufacturing process and start making GaN chips in the coming years.

Samsung expects its SF2 (2nm-class) fabrication technology to provide a 25% higher power efficiency (at the same frequency and transistor count), a 12% higher performance (at the same power and complexity), and a 5% decrease in area (at the same transistor count) when compared to SF3 (2nd Generation 3nm-class), the company revealed at SFF 2023. The company will start making mobile SoCs on 2nm node in 2025 and in follow up with HPC-enhanced SF2P node in 2026. Meanwhile, SF1.4 (1.4nm-class) manufacturing process is projected to be available to Samsung’s customers in 2027.

To make its SF2 node more competitive, Samsung intends to ensure that its customers will have access to a collection of high-quality SF2 IPs shortly, including interfaces like LPDDR5x, HBM3P, PCIe Gen6, and 112G SerDes.

(Image credit: Samsung)

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